Our Capability-Your Benefit
Our services in the Embedded Systems Product Development area are aimed at creating innovative and value driven applications for our customers across various industries.
EMBEDDED HARDWARE
- • Component Selection
- • Schematic Design: System-on-Module (SoM), SoC, FPGA, Microcontroller, High-Speed Memory, Switching Power Supplies, High-Speed Interfaces
- • HDL based (Verilog/VHDL) Design Flow, Synthesis, Verification
- • PCB Layout: Impedance Control, High-Speed
(upto 10G), Via-in-pad, BGA, HDI - • PCB Fabrication: 3mil/3mil, 0201, BGA 0.5mm, upto 20-layer, HDI
- • PCB Assembly: IPC Class 2, Multi-layer, 0201, BGA 0.5mm
- • Enclosure Integration
- • Rugged board level solutions (DFR)
- • Design for Production (DFT, DFM)
- • Mass Production Ready Designing
EMBEDDED SOFTWARE
- • BSP for embedded/real-time Linux, Android, various embedded RTOSs, etc.
- • Real time embedded applications
- • Multiple embedded processors / controllers / FPGAs from leading vendors e.g. NXP, TI, Nvidia, Mediatek, Intel, Xilinx, Altera, Microchip
- • GUI Development
- • IoT: AWS, MQTT
- • Protocols: TCP/IP, Ethernet, WiFi, GSM/GPRS, GPS
- • Languages: Assembly, C, C++, VC++, JAVA, Java Script
MECHANICAL DESIGN
- • Enclosure Design (Plastic, Metal)
- • CAD/3D Solid modeling
- • Thermal Analysis
- • Prototyping
- • Tooling